This LCP is designed for Laser Direct Structuring, low dielectric constant, and low dissipation factor
High performance injection moulding LCP designed for miniaturisation of antenna, sensor and connector.
Its mechanical strength is high enough to withstand a drop test in electronics and automotive applications.
| Densità (g/cm³) | - |
| Fluidità (g/10 min) | - |
| Fiammabilità | V-0(0.8 mm) |
| Prova di impatto Izod ASTM 256 (J/m) | - |
| Prova di impatto Izod ISO 180 (kJ/m²) | - |
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