This LCP is designed for Laser Direct Structuring, low dielectric constant, and low dissipation factor
High performance injection moulding LCP designed for miniaturisation of antenna, sensor and connector.
Its mechanical strength is high enough to withstand a drop test in electronics and automotive applications.
| Densidad (g/cm³) | - |
| Fluidez (g/10 min) | - |
| Grado de inflamabilidad | V-0(0.8 mm) |
| Impacto Izod entallado ASTM 256 (J/m) | - |
| Impacto Izod entallado ISO 180 (kJ/m²) | - |
No se enumeran especificaciones para este producto.
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